NAME Dual Beam FEG-SEM FIB

DESCRIPTION

Equipo DualBeam QUANTA3DFEG de FEI. Dispone de un microscopio electrónico de barrido de alta resolución (~1nm) y de un cañón de iones de Galio que permite la deposición y ablación de material. Además, se ha desarrollado un software para análisis de imágenes que permite resolver las tensiones residuales a partir de las imágenes obtenidas de FEGSEM en un rango de escalas desde 1 um hasta 800 um y unas 0.5 - 50 um de profundidad.

FIELDS OF APPLICATION

Grinding and finishing technologies

MOST OUTSTANDING EQUIPMENT AND COMPONENTS

  • Digital Image Correlation software developed by CEIT-IK4 in MATLAB

    CEIT-iK4 has developed an image analysis software that allows to solve the residual stresses from the images obtained from FEGSEM before and after FIB milling in a range of scales from 1 um to 800 um and 0.5 - 50 um depth.

  • DualBeam QUANTA3DFEG

    DualBeam QUANTA3DFEG equipment from FEI. It has a high-resolution scanning electron microscope (~1nm) and a Gallium ion cannon that allows the deposition and ablation of material.

SERVICES OFFERED BY THE ASSET

Measurement of residual stress profiled across welding and HAZ

Distribution of residual stresses across a welded surface with micrometric resolution. Study of the profile of residual stresses across the Heat Affected Zone (HAZ).

Measurement of stress profiles in depth of machined surfaces

Measurement of the evolution of the residual stress tensor with depth in the range of 0.5-50 micron. More sensitive within this range that conventional hole drilling techniques

Measurement of the distribution of residual stresses along a machined surface

Distribution of residual stresses along a machined surface with micrometric resolution. No alternative method is currently available with this spatial resolution.

ENTITY MANAGING THE ASSET

ENTITY MANAGING THE ASSET
CEIT
Contact person:
Jon Alkorta
jalkorta@ceit.es