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NAME

Dual Beam FEG-SEM FIB

DESCRIPTION

DualBeam QUANTA3DFEG equipment from FEI. It has a high-resolution scanning electron microscope (~1nm) and a Gallium ion cannon that allows the deposition and ablation of material. In addition, there has been developed an image analysis software that allows to solve the residual stresses from the images obtained from FEGSEM before and after FIB milling in a range of scales from 1 um to 800 um and 0.5 - 50 um depth.

MOST OUTSTANDING EQUIPMENT AND COMPONENTS

CEIT-iK4 has developed an image analysis software that allows to solve the residual stresses from the images obtained from FEGSEM before and after FIB milling in a range of scales from 1 um to 800 um and 0.5 - 50 um depth.

DualBeam QUANTA3DFEG equipment from FEI. It has a high-resolution scanning electron microscope (~1nm) and a Gallium ion cannon that allows the deposition and ablation of material.

SERVICES OFFERED BY THE ASSET

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357

Measurement of residual stress profiled across welding and HAZ

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347

Measurement of stress profiles in depth of machined surfaces

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349

Measurement of the distribution of residual stresses along a machined surface

ENTITY MANAGING THE ASSET

CEIT

Contact person: Jon Alkorta

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