Gailu biomedikoak diseinatzeko eta fabrikatzeko ekipamendu eta laborategiak

Fabrication of elastomeric mould replicas by casting or transferring of mould microstructures to thermoplastics by hot embossing techniques

Reversible or irreversible bonding of silicon, glass and polymers by means of the corresponding technique: anodic bonding or surface activation by oxygen plasma

Bulk removal of silicon by means of micromachining techniques

Personalised design of biosensors, polymeric membranes and microfluidic platforms

Fabrication of simple or coaxial polymer nanofibers either with or without drug load, in random or patterned configurations

Selective removal of thin films by means of wet and/or dry etching (RIE)

Structural photoresist-based moulds obtained by UV lithography or metal layer-based moulds by electroplating

Modification of surface properties (hydrophobicity or hydrophilicity) by means of oxygen plasma activation

Measurement of the thickness from thin films (a few nm) up to 120 um-thick microstructures by profilometry and/or atomic force microscopy

Thermal annealing of devices in non-reactive environments up to 1200ºC

Deposition of up to 5µm-thick layers onto planar substrates (max. diameter 10 cm). Films can be made of metals, metal oxides or silicon oxides or nitrides, and deposited by PVD, CVD or electroplating techniques

Resist patterning for microelectrode definition or passivation layer etching

Dicing of whole wafers of silicon, glass or thermoplastics into individualized devices with customized dimensions