DualBeam QUANTA3DFEG equipment from FEI. It has a high-resolution scanning electron microscope (~1nm) and a Gallium ion cannon that allows the deposition and ablation of material. In addition, there has been developed an image analysis software that allows to solve the residual stresses from the images obtained from FEGSEM before and after FIB milling in a range of scales from 1 um to 800 um and 0.5 - 50 um depth.
CEIT-iK4 has developed an image analysis software that allows to solve the residual stresses from the images obtained from FEGSEM before and after FIB milling in a range of scales from 1 um to 800 um and 0.5 - 50 um depth.
DualBeam QUANTA3DFEG equipment from FEI. It has a high-resolution scanning electron microscope (~1nm) and a Gallium ion cannon that allows the deposition and ablation of material.
Measurement of residual stress profiled across welding and HAZ
Measurement of stress profiles in depth of machined surfaces
Measurement of the distribution of residual stresses along a machined surface
CEIT
Contact person: Jon Alkorta
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